Failure Analysis Principles/Procedures

v  Failure and Yield analysis is performed to ~ Identify the root failure  Mechanism ~ Take Corrective Action ~ Avoid future failures v  Category ~ Failure Analysis (Product Analysis) -  packaged products ~ Yield Analysis – un-packaged products

v  Definition of FA ~ failure and yield analysis is a set of precise analysis steps used to determine the root cause in order that a corrective action plan can be put in place to prevent the failure from occurring in the future.

v  Practical Principles ~ Understand what your customer wants up front ~ Fast Techniques rule over brute force techniques ~ Less costly equipment rules over more costly equipment ~ Less destructive techniques rule over more destructive techniques v  Process Flows for FA ~ Exhaustive Confidence (high visibility) ~ High Confidence (routine full analyses) ~ Medium Confidence (brief analysis) ~ Low Confidence (quick and dirty)

v  Why is Fault Localization Important? ~ the location of the failure must be known in order to be characterized and diagnosed ~ if the failure is not evident on test structures or SRAMs, then localization must be performed on the product die

v  Why is Fault Isolation Difficult? ~ ICs are complex ~ Analysts unfamiliar with circuit design ~ Computers do most of the layout and synthesis on current design ~ Design department do not adequately utilize techniques that aid in fault isolation

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